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An evaluation of the temperature dependence of cohesive properties for two structural epoxy adhesives
Högskolan i Skövde, Institutionen för teknik och samhälle. (Mechanics of Materials)
Högskolan i Skövde, Institutionen för teknik och samhälle.
Högskolan i Skövde, Institutionen för teknik och samhälle.
2012 (Engelska)Ingår i: 19th European Conference on Fracture, Kazan Scientific Centre of the Russian Academy of Sciences , 2012Konferensbidrag, Publicerat paper (Refereegranskat)
Abstract [en]

Cohesive modelling provides a more detailed understanding of the fracture properties of adhesivejoints than provided by linear elastic fracture mechanics. A cohesive model is characterized by astress-deformation relation of the adhesive layer. This relation can be measured experimentally.Two parameters of the stress-deformation relation are of special importance; the area under thecurve, which equals the fracture energy, and the peak stress. The influence of temperature of theseparameters is analyses experimentally and evaluated statistically for two structural epoxy adhesivesin the span from of -40°C to +80°C. The adhesives are used by the automotive industry and atemperature span below the glass transition temperature is considered. The results show that thattemperature has a modest influence on the adhesives Mode I fracture energy. For one of theadhesives, the fracture energy is independent of the temperature in the evaluated temperature span.In mode II, the influence of temperature is larger. The peak stresses decreases almost linearly withan increasing temperature in both loading cases and for both adhesives.

Ort, förlag, år, upplaga, sidor
Kazan Scientific Centre of the Russian Academy of Sciences , 2012.
Nyckelord [en]
Double cantilever beam, End notched flexure, Fracture energy, Kruskal-Wallis test, Peak stress, Regression analyses.
Nationell ämneskategori
Maskinteknik
Forskningsämne
Teknik
Identifikatorer
URN: urn:nbn:se:his:diva-6400Scopus ID: 2-s2.0-84905457806ISBN: 978-5-905576-18-8 (tryckt)OAI: oai:DiVA.org:his-6400DiVA, id: diva2:553362
Konferens
19th European Conference on Fracture, Kazan, Russia, Aug. 26-31 2012
Tillgänglig från: 2012-10-10 Skapad: 2012-09-19 Senast uppdaterad: 2019-09-19Bibliografiskt granskad
Ingår i avhandling
1. Cohesive modelling of the temperature dependence of epoxy based adhesives in Mode I and Mode II loading
Öppna denna publikation i ny flik eller fönster >>Cohesive modelling of the temperature dependence of epoxy based adhesives in Mode I and Mode II loading
2013 (Engelska)Licentiatavhandling, sammanläggning (Övrigt vetenskapligt)
Abstract [en]

In this work, the influence of the temperature on the cohesive laws for two epoxy adhesives is studied at temperatures below the glass transition temperature for both Mode I and Mode II loading. Cohesive laws are measured experimentally under quasi-static loading conditions in the temperature range -30≤T≤80"C" . Three parameters of the cohesive laws are studied in detail: the elastic stiffness, the peak stress and the fracture energy. Methods for determining the elastic stiffness in Mode I and Mode II are derived and evaluated. With these methods, the results in this work show that it is possible to measure all three parameters for each pure mode loading case by the use of only the DCB- and the ENF-test specimens. Even though the measures tend to spread in values, this can significantly reduce the cost for performing experiments. It is shown that most of the cohesive parameters are decreasing with an increasing temperature in both loading modes and for both adhesives. An exception is the Mode I fracture energy for one of the adhesives. This is shown to be independent of the temperature in the studied temperature range. For the same adhesive, the Mode II fracture energy is shown to be continuously decreasing with an increasing temperature. The experimental results are verified by finite element analyses. The simulations only consider uncoupled cohesive behaviours. By use of the experimental results, simplified bi-linear cohesive laws to be used at any temperature within the studied temperature range are derived for one adhesive in both loading modes. This is desired in order to simulate adhesively bonded structures that suffer a wide range in temperature.

Ort, förlag, år, upplaga, sidor
Göteborg: Chalmers University of Technology, 2013. s. iii, 6 s. (tot 48)
Serie
Thesis for licentiate of engineering, ISSN 1652-8565 ; 2013:08
Nyckelord
Cohesive laws, Epoxy adhesive, Fracture energy, Peak stress, Temperature, Regression analyses, Shear modulus, Young’s modulus.
Nationell ämneskategori
Materialteknik
Forskningsämne
Teknik
Identifikatorer
urn:nbn:se:his:diva-8390 (URN)
Presentation
2013-04-04, Gamma/Delta, 10:00
Opponent
Handledare
Anmärkning

Ett av två delarbeten (övrigt se rubriken Delarbeten):

Paper A:

Walander, T., Biel, A. and Stigh, U., “Temperature dependence of cohesive laws for an epoxy adhesive in Mode I and Mode II loading”. Submitted

Tillgänglig från: 2013-08-12 Skapad: 2013-08-12 Senast uppdaterad: 2017-11-27Bibliografiskt granskad

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Scopushttp://www.his.se/PageFiles/31698/Paper%20ECF19%20Stat%20Reviderad.pdf

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Walander, TomasBiel, AndersStigh, Ulf

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